Stock shape of high thermal conductivity PEEK with insulative property

Heat resistanceHigh thermal conductivity

 Compression molding 

SCM5H00 (HTC PEEK) is a stock shape of high thermal conductivity PEEK with insulative property made by compression molding: PBI Method.

Characteristics of SCM5H00

Thermal property:
Thermal conductivity: more than 5 W m-1K-1

Insulative property:
Surface resistance: more than 1013 Ω

Water absorption:
Stable dimensions and electrical properties because of low water absorption

Typical properties of SCM5H00

Item Condition Standard Unit Property
SCM5H00
Tensile strength 23°C ISO 527 MPa 40
Tensile strain at break
 23°C ISO 527 % 0.3
Flexural strength 23°C ISO 178 MPa 65
Flexural modulus 23°C ISO 178 GPa 17
Charpy notched impact strength
 23°C ISO 179 kJ m-2 1.0
Coefficient of linear thermal expansion < Tg JIS K7197 ppm °C-1 -
Surface resistance 23°C ANSI/ESD STM11.13 Ω
 > 1013
Water absorption 23°C, 24 hr ISO 62 % 0.02

These values are not to be construed as specifications.

 

Lineup of SCM5H00

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