PEEK polymer indicates better heat resistance in thermoplastic polymers. The relative thermal index is 260°C, and the heat deflection temperature of the material reinforced by carbon or glass fiber is more than 300°C.
The main application of PEEK is wafer carriers in semiconductor manufacturing process, seal rings for automatic transmission, and so on.
PEEK polymer also shows excellent chemical resistance the next to fluorocarbon polymers, and better mechanical properties than fluorocarbon polymers. That means that it is possible to use PEEK material to the parts for hard disk manufacturing process and piping parts which are required mechanical strength and chemical/water resistance.
Moreover, PBI Advanced Materials can make large pipe, the diameter of which is more than 300 mm, by compression molding.
Typical properties of PEEK
|Glass transition temperature: Tg||-||DSC||°C||~140|
|Tensile strength||23°C||ISO 527||MPa||100|
|Tensile elongation||23°C||ISO 527||%||45|
|Flexural strength||23°C||ISO 178||MPa||165|
|Flexural modulus||23°C||ISO 178||GPa||4.1|
|Charpy impact strength, notched||23°C||ISO 179||kJ m-2||7.0|