Special grade

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SCM5200

Stock Shapes for
high-frequency IC applications [Compression]
~ Rigid PEEK ~

SCM5200 (Rigid PEEK) is a material with a low dielectric constant control in order to use the socket for high-frequency IC.

By blending the fine additive, SCM5200 is easy to remove burrs during machining.

Features
Machinability:
Easy to deburr after machining and provide finer machining possibility
High Frequency:
Dielectric Constant = 3.6 (1MHz)
Heat resistance:
Low CTE and excellent dimensional stability
ItemUnitSpecSCM5200Natural PEEK
Tensile Strength MPa JIS K7161 80 100
Elongation % JIS K7161 1.2 45
Flexural Strength MPa JIS K7171 120 165
Flexural Modulus GPa JIS K7171 9.5 4.1
Charpy Impact Strength (Notched) kJ m-2 JIS K7111-1 1.2 7.0
Surface Resistivity Ω sq-1 ANSI/ESD STM11.13 >1013 >1013
Linear Thermal Expansion (~120°C) ppm °C-1 JIS K7197 33 55
Water Absorption (24hur@23°C) % JIS K7209 0.09 0.07

SCM5200-15

Insulated Stock Shapes
with finer machining possibility [Compression]
~ Rigid PEEK15 ~

SCM5200-15 (Rigid PEEK15) exhibits excellent dimensional stability due to its lower water absorption. It has low dielectric constant and is compatible with high frequency IC applications.

SCM5200-15 easily removes burrs during the machining process and is possible to reduce the damage caused by processing and impact by controlling the amount of nano-sized filler.

Features
Machinability:
Easy to deburr after machining and provide finer machining possibility
High Frequency:
Dielectric Constant = 3.6 (1MHz)

Heat resistance:
Low CTE and excellent dimensional stability
About nano-sized fiber

With nano-sized filler addition, it lowers PEEK’s unique viscosity and is easier to deburr after machining. Comparing with micron-sized filler, the damages caused by edged tools during machining process is less.

By combining with various nano-sized filler, it is possible to provide new base materials for cutting work, which was not available in the market until now.

ItemUnitSpecSCM5200-15Natural PEEK
Tensile Strength MPa JIS K7161 75 100
Elongation % JIS K7161 1.4 45
Flexural Strength MPa JIS K7171 100 165
Flexural Modulus GPa JIS K7171 7.0 4.1
Charpy Impact Strength (Notched) kJ m-2 JIS K7111-1 1.5 7.0
Surface Resistivity Ω sq-1 ANSI/ESD STM11.13 >1013 >1013
Linear Thermal Expansion (~120°C) ppm °C-1 JIS K7197 - 55
Water Absorption (24hur@23°C) % JIS K7209 - 0.07

SCM5200-50

High rigidity stock shapes
to reduce warpage of IC test socket [Compression]
~ Rigid PEEK50 ~

SCM5200-50 (Rigid PEEK50) contains the fine ceramics filler. SCM5200-50 has three times higher flexural modulus and lower CTE than natural PEEK.

Burrs are easily removed after machining and ideal for machining process.

Features
Machinability:
Easy to deburr after machining and provide finer machining possibility
High rigid
/High flexural modulus:
Compared with natural PEEK, 3 times higher flexural modulus and 1/2 of CTE

Heat resistance:
Low CTE and excellent dimensional stability
ItemUnitSpecSCM5200-50Natural PEEK
Tensile Strength MPa JIS K7161 80 100
Elongation % JIS K7161 0.8 45
Flexural Strength MPa JIS K7171 120 165
Flexural Modulus GPa JIS K7171 13.2 4.1
Charpy Impact Strength (Notched) kJ m-2 JIS K7111-1 1.8 7.0
Surface Resistivity Ω sq-1 ANSI/ESD STM11.13 >1013 >1013
Linear Thermal Expansion (~120°C) ppm °C-1 JIS K7197 25 55
Water Absorption (24hur@23°C) % JIS K7209 0.10 0.07

SCM5H00

Stock Shapes exhibiting both thermal conductivity
and insulation properties [Compression]
~ HTC PEEK ~

SCM5H00 (HTC PEEK) are using the Boron Nitride as additives, and exhibits excellent properties both insulating and thermal conductivity.

By using PEEK polymer as base resins, SCM5H00 has excellent heat resistance as well.

Features
Thermal Conductivity:
Realizing good thermal conductivity more than 10 times (> 5W/m•K), compared to general resins
Insulation Properties:
Surface resistivity is higher than 1013Ω/□
Heat resistance:
Low CTE and excellent dimensional stability
About PBI Method

PBI Method is a unique compression molding technology developed and patented by Sato Group.

This method is different from the existing PTFE-production method that molds an article under pressure at room temperature and then sinters it in an oven. PBI Method is a molding procedure. The stock shapes are molded simultaneously at high temperature, and under high pressure. After which they are cooled gradually and then ejected. PBI Method can give efficient degassing in the molds thus avoiding internal voids in the molded article.

ItemUnitSpecSCM5H00Natural PEEK
Tensile Strength MPa JIS K7161 40 100
Elongation % JIS K7161 0.3 45
Flexural Strength MPa JIS K7171 65 165
Flexural Modulus GPa JIS K7171 17.0 4.1
Charpy Impact Strength (Notched) kJ m-2 JIS K7111-1 1.0 7.0
Surface Resistivity Ω sq-1 ANSI/ESD STM11.13 >1013 >1013
Linear Thermal Expansion (~120°C) ppm °C-1 JIS K7197 - 55
Water Absorption (24hur@23°C) % JIS K7209 0.02 0.07

Color Pellet

Color Pellet
~ PEEK ~

Using PEEK polymer, we blend the color on your requests.

  • - White
  • - Yellow
  • - Blue
  • - Blue Gray
  • - Light Gray
  • … and more
ItemUnitSpecNatural PEEK
Tensile Strength MPa JIS K7161 100
Elongation % JIS K7161 45
Flexural Strength MPa JIS K7171 165
Flexural Modulus GPa JIS K7171 4.1
Charpy Impact Strength (Notched) kJ m-2 JIS K7111-1 7.0
Surface Resistivity Ω sq-1 ANSI/ESD STM11.13 >1013
Linear Thermal Expansion (~120°C) ppm °C-1 JIS K7197 55
Water Absorption (24hur@23°C) % JIS K7209 0.07

Color Plate

Color Plate
[Compression]
~ PEEK ~

Using PEEK polymer, we blend the color on your requests.

  • - White
  • - Yellow
  • - Blue
  • - Blue Gray
  • - Light Gray
  • … and more
ItemUnitSpecNatural PEEK
Tensile Strength MPa JIS K7161 100
Elongation % JIS K7161 45
Flexural Strength MPa JIS K7171 165
Flexural Modulus GPa JIS K7171 4.1
Charpy Impact Strength (Notched) kJ m-2 JIS K7111-1 7.0
Surface Resistivity Ω sq-1 ANSI/ESD STM11.13 >1013
Linear Thermal Expansion (~120°C) ppm °C-1 JIS K7197 55
Water Absorption (24hur@23°C) % JIS K7209 0.07

PBI Coatings

High performance coating materials
~PBI~